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PCB Manufacturing Capabilities

by: Nov 26,2013 1859 Views 0 Comments Posted in Engineering Technical

PCB Manufacturing Capabilities

At Bare Board Group, the need of each individual customer is important to us. We strive to provide our clientele with an expanded catalog of manufacturing capabilities in order to fit the wide variety of quality printed circuit boards (PCBs) they require. Below you will find a listing of Bare Board Group's standard manufacturing capabilities. If you require something that is not listed, please contact BBG to give us the opportunity to accommodate YOUR individual need.

Standard Materials
FR-4 170TG
Rogers CEM
Aluminum  Nelco
Halogen Free Dupont LF & RF Series
Taconic    

PCB
 
Standard Technologies  
Double Sided Multi Layer
Rigid Flex Metal Core
Flex Thermal
Buried Resistance/Capacitance Conductive/Non-Conductive Filled Vias
Cu Filled Vias  

PCB
 
Standard Panel  
Largest PCB Size 20 x 30 inches
Layer Count 1-26 Layers
Min Rigid Board Thickness 0.010"
Max Rigid Board Thickness 0.250"
Board Thickness Tolerance +/- 10%
Routing Tolerance +/- 0.005

PCB
 
Standard Drill
Min PTH Mechanical 0.008" (0.23 mm)
Min Laser Drill 0.002"
PTH Tolerance +/- 0.003 (0.076 mm)
Aspect Ratio (THK: DHS) 10:1

PCB
 
Standard Copper
Max Copper Inner Thickness 3 oz
Max Copper Outer Thickness 6 oz
Min Copper Thickness 0.5 oz
 
Standard Trace / Space
Min Trace/Space 0.0035/ 0.0035
 
Standard Surface Finishes
Lead Solder (HASL) Lead-Free Solder (HASL)
Hard Gold Immersion Gold (ENIG)
Soft Gold OSP
Immersion Silver Immersion Tin
 
Options
Gold Fingers Selective Au
Peelable Mask Carbon Ink
Controlled Impedance Laser Drill
Score Punch and Return
Via-In-Pad Blind Vias
Buried Vias Stacked Vias
Plugged Vias  
 
Special Materials
Getek Arlon
Ceramic Ohmega Ply
AD10  Stablcor
CIC  
 
Special Technologies  
HDI Cu Filled Vias
Bonded Heatsinks  
 
Special Panel  
Largest PCB Size 24 x 24 inches
Layer Count 1-44 Layers
 
Special Drill
Min PTH Mechanical 0.0079" (0.2 mm)
PTH Tolerance +/- 0.002" (0.05 mm)
 
Special Trace / Space
Min Trace/Space 0.002/ 0.002
 
Special Surface Finishes
Electroless Nickel / Immersion Palladium / Immersion Gold (ENIPIG)

All printed circuit quoted IPC-A-600 Class 2, IPC-6012 Class 3 quoted upon request

Certifications
?ISO 9001:2008
?ITAR Compliant - On and Offshore
?UL certified
?TS 16949 Certified
?RoHS Compliant
?QS 9000 Compliant
?MIL-PRF-55110
?NADCAP AC 7119
?BS EN 9100: 2009 (AS 9100 Rev C)

Additional BBG Services
?High-Mix, Low-to-High Volume: 2-5 Weeks, domestic and offshore
?Prototyping and Short Run: 3-5 day (domestic), 5-10 day (offshore)
?Engineering Support for: Stack Ups, DFMs and Impedance Models
?Logistics Programs: VMI, Consignment, Global Staging, Kan Ban
?Testing: IST, Hi-Pot, Flying Probe, Grid, TDR, Ionic, Solder Float

Examples of the industries BBG serves
?Smart devices
?Safety and Security
?Automotive
?RF
?Medical
?Industrial Controls
?Consumer Products
?Signage (LED)

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