The newest version of PCBWay Multi-layer laminated structure

The following is the old version, the new version has a brand new update, please pay attention here

Last updated: October 2020 PCBWay Multi-layer laminated structure>>

Last updated: Old version 2019

4-layer PCB standard stackup

Thickness Copper thick Laminated chart1.6mm±10%1oz Copper 1 18 um--plating to 35um

Dielectric 1-2 0.11 mm dielectric constant 4.29

Copper 2 35 um

Dielectric 2-3 1.13 mm dielectric constant 3.96

Copper 3 35 um

Dielectric 3-4 0.11 mm dielectric constant 4.29

Copper 4 18 um--plating to 35um1.2mm±10%1oz Copper 1 18 um--plating to 35um

Dielectric 1-2 0.11 mm dielectric constant 4.29

Copper 2 35 um

Dielectric 2-3 0.73 mm dielectric constant 3.96

Copper 3 35 um

Dielectric 3-4 0.11 mm dielectric constant 4.29

Copper 4 18 um--plating to 35um1.0mm±0.1mm1oz Copper 1 18 um--plating to 35um

Dielectric 1-2 0.175 mm dielectric constant 4.29

Copper 2 35 um

Dielectric 2-3 0.53 mm dielectric constant 3.96

Copper 3 35 um

Dielectric 3-4 0.175 mm dielectric constant 4.29

Copper 4 18 um--plating to 35um0.8mm±0.1mm1oz Copper 1 18 um--plating to 35um

Dielectric 1-2 0.175 mm dielectric constant 4.29

Copper 2 35 um

Dielectric 2-3 0.33 mm dielectric constant 3.96

Copper 3 35 um

Dielectric 3-4 0.175 mm dielectric constant 4.29

Copper 4 18 um--plating to 35um0.6mm±0.1mm1oz Copper 1 18 um--plating to 35um

Dielectric 1-2 0.175 mm dielectric constant 4.29

Copper 2 35 um

Dielectric 2-3 0.17 mm dielectric constant 3.96

Copper 3 35 um

Dielectric 3-4 0.175 mm dielectric constant 4.29

Copper 4 18 um--plating to 35um0.4mm±0.1mm1oz Copper 1 18 um--plating to 35um

Dielectric 1-2 0.08 mm dielectric constant 4.29

Copper 2 35 um

Dielectric 2-3 0.17 mm dielectric constant 3.96

Copper 3 35 um

Dielectric 3-4 0.08 mm dielectric constant 4.29

Copper 4 18 um--plating to 35um2.0mm±10%1oz Copper 1 18 um--plating to 35um

Dielectric 1-2 0.175 mm dielectric constant 4.29

Copper 2 35 um

Dielectric 2-3 1.53 mm dielectric constant 3.96

Copper 3 35 um

Dielectric 3-4 0.175 mm dielectric constant 4.29

Copper 4 18 um--plating to 35um2.4mm±10%1oz Copper 1 18 um--plating to 35um

Dielectric 1-2 0.175 mm dielectric constant 4.29

Copper 2 35 um

Dielectric 2-3 1.93 mm dielectric constant 3.96

Copper 3 35 um

Dielectric 3-4 0.175 mm dielectric constant 4.29

Copper 4 18 um--plating to 35um0.8mm±0.1mminner 1.5OZ Copper 1 18 um--plating to 35um

Dielectric 1-2 0.22 mm dielectric constant 4.29

Copper 2 53 um

Dielectric 2-3 0.094 mm dielectric constant 3.96

Copper 3 53 um

Dielectric 3-4 0.22 mm dielectric constant 4.29

Copper 4 18 um--plating to 35um1.0mm±0.1mminner 1.5OZ Copper 1 18 um--plating to 35um

Dielectric 1-2 0.22 mm dielectric constant 4.29

Copper 2 53 um

Dielectric 2-3 0.294 mm dielectric constant 3.96

Copper 3 53 um

Dielectric 3-4 0.22 mm dielectric constant 4.29

Copper 4 18 um--plating to 35um1.2mm±10%inner 1.5OZ Copper 1 18 um--plating to 35um

Dielectric 1-2 0.22 mm dielectric constant 4.29

Copper 2 53 um

Dielectric 2-3 0.494 mm dielectric constant 3.96

Copper 3 53 um

Dielectric 3-4 0.22 mm dielectric constant 4.29

Copper 4 18 um--plating to 35um1.6mm±10%inner 1.5OZ Copper 1 18 um--plating to 35um

Dielectric 1-2 0.22 mm dielectric constant 4.29

Copper 2 53 um

Dielectric 2-3 0.894 mm dielectric constant 3.96

Copper 3 53 um

Dielectric 3-4 0.22 mm dielectric constant 4.29

Copper 4 18 um--plating to 35um2.0mm±10%inner 1.5OZ Copper 1 18 um--plating to 35um

Dielectric 1-2 0.22 mm dielectric constant 4.29

Copper 2 53 um

Dielectric 2-3 1.494 mm dielectric constant 3.96

Copper 3 53 um

Dielectric 3-4 0.22 mm dielectric constant 4.29

Copper 4 18 um--plating to 35um2.4mm±10%inner 1.5OZ Copper 1 18 um--plating to 35um

Dielectric 1-2 0.36 mm dielectric constant 4.29

Copper 2 53 um

Dielectric 2-3 1.494 mm dielectric constant 3.96

Copper 3 53 um

Dielectric 3-4 0.36 mm dielectric constant 4.29

Copper 4 18 um--plating to 35um Instrution:

1. Above stackup lists are our common factory’s standard stackup of 4-layer PCB.If you have the sepecial request,pls choose the "Custom Stackup" when placing orders.

2. When copper thickness increases, the dielectric layer will be reduced correspondingly.

3. The outer copper thickness can do 1OZ/2OZ,above stackup is for 1OZ.If the request is for 2OZ,we will use 1.5OZ or 2OZ base copper foil,and plate to 2OZ.

4. This layer pressure diagram is for reference only, we have the highest interpretation rights in the laminating process, if there is any question, please contact the manager！

6-layer PCB standard stackup

Thickness Copper thick Laminated chart1.6mm±10%1oz Copper 1 18 um--plating to 35um

Dielectric 1-2 0.11 mm dielectric constant 4.29

Copper 2 35 um

Dielectric 2-3 0.53 mm dielectric constant 3.96

Copper 3 35 um

Dielectric 3-4 0.11 mm dielectric constant 4.29

Copper 4 35 um

Dielectric 4-5 0.53 mm dielectric constant 3.96

Copper 5 35 um

Dielectric 5-6 0.11 mm dielectric constant 4.29

Copper 6 18 um--plating to 35um1.2mm±10%1oz Copper 1 18 um--plating to 35um

Dielectric 1-2 0.11 mm dielectric constant 4.29

Copper 2 35 um

Dielectric 2-3 0.33 mm dielectric constant 3.96

Copper 3 35 um

Dielectric 3-4 0.11 mm dielectric constant 4.29

Copper 4 35 um

Dielectric 4-5 0.33 mm dielectric constant 3.96

Copper 5 35 um

Dielectric 5-6 0.11 mm dielectric constant 4.29

Copper 6 18 um--plating to 35um1.0mm±0.1mm1oz Copper 1 18 um--plating to 35um

Dielectric 1-2 0.175 mm dielectric constant 4.29

Copper 2 35 um

Dielectric 2-3 0.13 mm dielectric constant 3.96

Copper 3 35 um

Dielectric 3-4 0.175 mm dielectric constant 4.29

Copper 4 35 um

Dielectric 4-5 0.13 mm dielectric constant 3.96

Copper 5 35 um

Dielectric 5-6 0.175 mm dielectric constant 4.29

Copper 6 18 um--plating to 35um0.8mm±0.1mm1oz Copper 1 18 um--plating to 35um

Dielectric 1-2 0.11 mm dielectric constant 4.29

Copper 2 35 um

Dielectric 2-3 0.13 mm dielectric constant 3.96

Copper 3 35 um

Dielectric 3-4 0.11 mm dielectric constant 4.29

Copper 4 35 um

Dielectric 4-5 0.13 mm dielectric constant 3.96

Copper 5 35 um

Dielectric 5-6 0.11 mm dielectric constant 4.29

Copper 6 18 um--plating to 35um2.0mm±10%1oz Copper 1 18 um--plating to 35um

Dielectric 1-2 0.11 mm dielectric constant 4.29

Copper 2 35 um

Dielectric 2-3 0.73 mm dielectric constant 3.96

Copper 3 35 um

Dielectric 3-4 0.11 mm dielectric constant 4.29

Copper 4 35 um

Dielectric 4-5 0.73 mm dielectric constant 3.96

Copper 5 35 um

Dielectric 5-6 0.11 mm dielectric constant 4.29

Copper 6 18 um--plating to 35um2.4mm±10%1oz Copper 1 18 um--plating to 35um

Dielectric 1-2 0.11 mm dielectric constant 4.29

Copper 2 35 um

Dielectric 2-3 0.93 mm dielectric constant 3.96

Copper 3 35 um

Dielectric 3-4 0.11 mm dielectric constant 4.29

Copper 4 35 um

Dielectric 4-5 0.93 mm dielectric constant 3.96

Copper 5 35 um

Dielectric 5-6 0.11 mm dielectric constant 4.29

Copper 6 18 um--plating to 35um1.0mm±0.1mminner 1.5OZ Copper 1 18 um--plating to 35um

Dielectric 1-2 0.16 mm dielectric constant 4.29

Copper 2 53 um

Dielectric 2-3 0.094mm dielectric constant 3.96

Copper 3 53 um

Dielectric 3-4 0.16 mm dielectric constant 4.29

Copper 4 53 um

Dielectric 4-5 0.094 mm dielectric constant 3.96

Copper 5 53 um

Dielectric 5-6 0.16 mm dielectric constant 4.29

Copper 6 18 um--plating to 35um1.2mm±10%inner 1.5OZ Copper 1 18 um--plating to 35um

Dielectric 1-2 0.22 mm dielectric constant 4.29

Copper 2 53 um

Dielectric 2-3 0.094mm dielectric constant 3.96

Copper 3 53 um

Dielectric 3-4 0.22 mm dielectric constant 4.29

Copper 4 53 um

Dielectric 4-5 0.094 mm dielectric constant 3.96

Copper 5 53 um

Dielectric 5-6 0.22 mm dielectric constant 4.29

Copper 6 18 um--plating to 35um1.6mm±10%inner 1.5OZ Copper 1 18 um--plating to 35um

Dielectric 1-2 0.22 mm dielectric constant 4.29

Copper 2 53 um

Dielectric 2-3 0.294mm dielectric constant 3.96

Copper 3 53 um

Dielectric 3-4 0.22 mm dielectric constant 4.29

Copper 4 53 um

Dielectric 4-5 0.294 mm dielectric constant 3.96

Copper 5 53 um

Dielectric 5-6 0.22 mm dielectric constant 4.29

Copper 6 18 um--plating to 35um2.0mm±10%inner 1.5OZ Copper 1 18 um--plating to 35um

Dielectric 1-2 0.36 mm dielectric constant 4.29

Copper 2 53 um

Dielectric 2-3 0.294mm dielectric constant 3.96

Copper 3 53 um

Dielectric 3-4 0.36 mm dielectric constant 4.29

Copper 4 53 um

Dielectric 4-5 0.294 mm dielectric constant 3.96

Copper 5 53 um

Dielectric 5-6 0.36 mm dielectric constant 4.29

Copper 6 18 um--plating to 35um2.4mm±10%inner 1.5OZ Copper 1 18 um--plating to 35um

Dielectric 1-2 0.36 mm dielectric constant 4.29

Copper 2 53 um

Dielectric 2-3 0.494mm dielectric constant 3.96

Copper 3 53 um

Dielectric 3-4 0.36 mm dielectric constant 4.29

Copper 4 53 um

Dielectric 4-5 0.494 mm dielectric constant 3.96

Copper 5 53 um

Dielectric 5-6 0.36 mm dielectric constant 4.29

Copper 6 18 um--plating to 35um Instrution:

1. Above stackup lists are our common factory’s standard stackup of 6-layer PCB.If you have the sepecial request,pls choose the "Custom Stackup" when placing orders.

2. When copper thickness increases, the dielectric layer will be reduced correspondingly.

3. The outer copper thickness can do 1OZ/2OZ,above stackup is for 1OZ.If the request is for 2OZ,we will use 1.5OZ or 2OZ base copper foil,and plate to 2OZ.

4. This layer pressure diagram is for reference only, we have the highest interpretation rights in the laminating process, if there is any question, please contact the manager！

8-layer PCB standard stackup

Thickness Copper thick Laminated chart1.6mm±10%1oz Copper 1 18 um--plating to 35um

Dielectric 1-2 0.175 mm dielectric constant 4.29

Copper 2 35 um

Dielectric 2-3 0.13 mm dielectric constant 3.96

Copper 3 35 um

Dielectric 3-4 0.175 mm dielectric constant 4.29

Copper 4 35 um

Dielectric 4-5 0.13 mm dielectric constant 3.96

Copper 5 35 um

Dielectric 5-6 0.175 mm dielectric constant 4.29

Copper 6 35 um

Dielectric 6-7 0.13 mm dielectric constant 3.96

Copper 7 35 um

Dielectric 7-8 0.175 mm dielectric constant 4.29

Copper 8 18 um--plating to 35um1.2mm±10%1oz Copper 1 18 um--plating to 35um

Dielectric 1-2 0.11 mm dielectric constant 4.29

Copper 2 35 um

Dielectric 2-3 0.13 mm dielectric constant 3.96

Copper 3 35 um

Dielectric 3-4 0.11 mm dielectric constant 4.29

Copper 4 35 um

Dielectric 4-5 0.13 mm dielectric constant 3.96

Copper 5 35 um

Dielectric 5-6 0.11 mm dielectric constant 4.29

Copper 6 35 um

Dielectric 6-7 0.13 mm dielectric constant 3.96

Copper 7 35 um

Dielectric 7-8 0.11 mm dielectric constant 4.29

Copper 8 18 um--plating to 35um2.0mm±10%1oz Copper 1 18 um--plating to 35um

Dielectric 1-2 0.175 mm dielectric constant 4.29

Copper 2 35 um

Dielectric 2-3 0.33 mm dielectric constant 3.96

Copper 3 35 um

Dielectric 3-4 0.175 mm dielectric constant 4.29

Copper 4 35 um

Dielectric 4-5 0.33 mm dielectric constant 3.96

Copper 5 35 um

Dielectric 5-6 0.175 mm dielectric constant 4.29

Copper 6 35 um

Dielectric 6-7 0.33 mm dielectric constant 3.96

Copper 7 35 um

Dielectric 7-8 0.175 mm dielectric constant 4.29

Copper 8 18 um--plating to 35um2.4mm±10%1oz Copper 1 18 um--plating to 35um

Dielectric 1-2 0.11 mm dielectric constant 4.29

Copper 2 35 um

Dielectric 2-3 0.53 mm dielectric constant 3.96

Copper 3 35 um

Dielectric 3-4 0.11 mm dielectric constant 4.29

Copper 4 35 um

Dielectric 4-5 0.53 mm dielectric constant 3.96

Copper 5 35 um

Dielectric 5-6 0.11 mm dielectric constant 4.29

Copper 35 um

Dielectric 6-7 0.53 mm dielectric constant 3.96

Copper 7 35 um

Dielectric 7-8 0.11 mm dielectric constant 4.29

Copper 8 18 um--plating to 35um1.6mm±10%inner 1.5OZ Copper 1 18 um--plating to 35um

Dielectric 1-2 0.22 mm dielectric constant 4.29

Copper 2 53 um

Dielectric 2-3 0.094 mm dielectric constant 3.96

Copper 3 53 um

Dielectric 3-4 0.22 mm dielectric constant 4.29

Copper 4 53 um

Dielectric 4-5 0.094 mm dielectric constant 3.96

Copper 5 53 um

Dielectric 5-6 0.22 mm dielectric constant 4.29

Copper 6 53 um

Dielectric 6-7 0.094 mm dielectric constant 3.96

Copper 7 53 um

Dielectric 7-8 0.22 mm dielectric constant 4.29

Copper 8 18 um--plating to 35um2.0mm±10%inner 1.5OZ Copper 1 18 um--plating to 35um

Dielectric 1-2 0.16 mm dielectric constant 4.29

Copper 2 53 um

Dielectric 2-3 0.294 mm dielectric constant 3.96

Copper 3 53 um

Dielectric 3-4 0.16 mm dielectric constant 4.29

Copper 4 53 um

Dielectric 4-5 0.294 mm dielectric constant 3.96

Copper 5 53 um

Dielectric 5-6 0.16 mm dielectric constant 4.29

Copper 6 53 um

Dielectric 6-7 0.294 mm dielectric constant 3.96

Copper 7 53 um

Dielectric 7-8 0.16 mm dielectric constant 4.29

Copper 8 18 um--plating to 35um2.4mm±10%inner 1.5OZ Copper 1 18 um--plating to 35um

Dielectric 1-2 0.22 mm dielectric constant 4.29

Copper 2 53 um

Dielectric 2-3 0.294 mm dielectric constant 3.96

Copper 3 53 um

Dielectric 3-4 0.22 mm dielectric constant 4.29

Copper 4 53 um

Dielectric 4-5 0.294 mm dielectric constant 3.96

Copper 5 53 um

Dielectric 5-6 0.22 mm dielectric constant 4.29

Copper 6 53 um

Dielectric 6-7 0.294 mm dielectric constant 3.96

Copper 7 53 um

Dielectric 7-8 0.22 mm dielectric constant 4.29

Copper 8 18 um--plating to 35um Instruction:

1. Above stackup lists are our common factory’s standard stackup of 8-layer PCB.If you have the sepecial request,pls choose the "Custom Stackup" when placing orders.

2. When copper thickness increases, the dielectric layer will be reduced correspondingly.

3. The outer copper thickness can do 1OZ/2OZ,above stackup is for 1OZ.If the request is for 2OZ,we will use 1.5OZ or 2OZ base copper foil,and plate to 2OZ.

4. This layer pressure diagram is for reference only, we have the highest interpretation rights in the laminating process, if there is any question, please contact the manager！