China-based PCB maker Shennan Circuits has begun small-volume production of wirebond substrates with mass production to start in the third quarter of 2014. Fellow company Founder PCB will also step into the IC substrate segment soon, according to industry sources.
Shennan has purchased production equipment aiming to ramp up its capacity 10-fold, and will begin shipping its wirebond substrates to IC backend service companies in China in the third quarter, the sources noted.
Other companies, including Founder PCB and China Circuit Technology (Shantou), have also been ramping up their technologies as well as capacity in order to step into the IC substrate segment, said the sources, adding that Founder PCB will begin trial substrate production shortly.
