1) IPC-ESD-2020
The joint standard for the development of electrostatic discharge control programs. Includes the design, establishment, implementation, and maintenance necessary for electrostatic discharge control procedures. Provide guidance for handling and protection during electrostatic discharge sensitive periods based on the historical experience of certain military and commercial organizations.
2) IPC-SA-61A
Semi-aqueous cleaning manual after welding. Including all aspects of semi-aqueous cleaning, including chemical, production residues, equipment, processes, process control, and environmental and safety considerations.
3) IPC-AC-62A
Hydration cleaning manual after welding. Describe manufacturing residues, types and properties of aqueous cleaners, processes, equipment and processes for aqueous cleaning, quality control, environmental control, and employee safety, and the cost of cleanliness measurement and determination
4) IPC-DRM-40E
Desktop reference manual for through-hole solder joint evaluation. A detailed description of components, hole walls, and soldering surfaces in accordance with standard requirements, in addition to computer-generated 3D graphics. Covers solder fillet, contact angle, tin dip, vertical fill, pad coverage, and numerous solder joint defects.
5) IPC-TA-722
Welding Technology Evaluation Manual. Includes 45 articles on various aspects of welding technology, covering general welding, welding materials, manual welding, batch welding, wave soldering, reflow soldering, vapor phase welding, and infrared welding.
6) IPC-7525
Template design guide. Provides guidelines for the design and manufacture of solder paste and surface mount adhesive coated stencils. I also discussed stencil design using surface mount technology and introduced components with through-holes or flip-chip? Kunhe technology, including overprint, double-print, and staged template design.
7) IPC / EIAJ-STD-004
Flux Specification Requirements One includes Appendix I. Contains technical indicators and classification of rosin, resin, etc., organic and inorganic fluxes classified according to the halide content and degree of activation in the flux; also includes the use of flux, substances containing flux, and low Residual flux.
8) IPC / EIAJ-STD-005
Solder paste specification requirements include Appendix I. Lists the characteristics and technical requirements of solder paste, including test methods and standards for metal content, as well as viscosity, slump, solder balls, stickiness, and soldering performance.
9) IPC / EIAJ-STD-006A
Specification requirements for electronic grade solder alloys, fluxes and non-flux solid solders. Electronic grade solder alloys, rod-shaped, strip-shaped, powdered fluxes and non-fluxed solders, for electronic solder applications, terminology, specification requirements and test methods for special electronic grade solders.
10) IPC-Ca-821
General requirements for thermally conductive adhesives. Includes requirements and test methods for thermally conductive dielectrics that bond components in place.
11) IPC-3406
Guide to Coating Adhesives on Conductive Surfaces. Provides guidance for the selection of conductive adhesives as alternatives to soldering in electronics manufacturing.
12) IPC-AJ-820
Assembly and welding manual. It contains a description of assembly and soldering inspection techniques, including terms and definitions; printed circuit boards, component and pin types, solder joint materials, component references, outlines and design guidelines; soldering techniques and packaging; Cleaning and laminating; quality assurance and testing.
13) IPC-7530
Guidelines for temperature profiles of batch soldering processes (reflow and wave soldering). In the acquisition of temperature curves, various testing methods, techniques and methods are used to provide guidance for establishing the best graphics.
14) IPC-TR-460A
Printed circuit board wave soldering troubleshooting list. A list of recommended corrective actions for failures that may be caused by wave soldering.
15) IPC / EIA / JEDECJ-STD-003A
Solderability test of printed circuit boards.
16) J-STD-013
Application of Spherical Grid Array Packaging (SGA) and other high-density technologies. Establish the specifications and interactions required for the printed circuit board packaging process to provide information for high-performance and high-pin-count integrated circuit package interconnections, including design principle information, choice of materials, board manufacturing and assembly technology, and test methods And reliability expectations based on the end-use environment.
17) IPC-7095
The design and assembly process for SGA devices is complimentary. Provides a variety of useful operational information for people who are using SGA devices or considering moving to array packaging; provide guidance for SGA inspection and repair and provide reliable information about the SGA field.
18) IPC-M-I08
Cleaning instruction manual. Includes the latest version of IPC cleaning instructions to assist manufacturing engineers as they determine the product’s cleaning process and troubleshooting.
19) IPC-CH-65-A
Cleaning guidelines in printed circuit board assembly. Provides references for current and emerging cleaning methods in the electronics industry, including descriptions and discussions of various cleaning methods, and explains the relationships between various materials, processes, and contaminants during manufacturing and assembly operations.
20) IPC-SC-60A
Cleaning manual for solvents after welding. The use of solvent cleaning technology in automatic welding and manual welding is given. The nature of solvents, residues, and process control and environmental issues are discussed.
21) IPC-9201
Surface Insulation Resistance Handbook. It contains terminology, theory, test procedures, and test methods for surface insulation resistance (SIR), as well as temperature, humidity (TH) tests, failure modes, and troubleshooting.
22) IPC-DRM-53
Introduction to the Electronic Assembly Desktop Reference Manual. Illustrations and photos to illustrate through-hole mounting and surface mount assembly techniques.
23) IPC-M-103
Surface mount assembly manual standard. This section includes all 21 IPC files related to surface mount.
24) IPC-M-I04
Printed circuit board assembly manual standard. It contains the 10 most widely used documents on printed circuit board assembly.
25) IPC-CC-830B
Performance and identification of electronic insulating compounds in printed circuit board assembly. The conformal coating meets an industry standard of quality and qualification.
26) IPC-S-816
Surface mount technology process guide and list. This troubleshooting guide lists all types of process problems encountered in surface mount assembly and their solutions, including bridging, missing soldering, and misaligned component placement.
27) IPC-CM-770D
Installation instructions for printed circuit board components. Provides effective guidance for the preparation of components in printed circuit board assembly, and reviews relevant standards, influence, and distribution, including assembly technology (manual and automatic as well as surface-mount technology and flip-chip assembly technology) And consideration of subsequent soldering, cleaning and laminating processes.
28) IPC-7129
Calculation of the number of failures per million opportunities (DPMO) and printed circuit board assembly manufacturing indicators. For the calculation of deficiencies and benchmarks agreed by the relevant industry sectors; it provides a satisfactory method for calculating the benchmarks for the number of failures per million opportunities.
29) IPC-9261
Printed circuit board assembly yield estimates and failures per million opportunities during assembly. A reliable method for calculating the number of failures per million opportunities during printed circuit board assembly is defined. It is a measure of evaluation during each stage of the assembly process.
30) IPC-D-279
Reliable surface mount technology printed circuit board assembly design guidelines. Guidelines for the reliable manufacturing process of printed circuit boards for surface mount and hybrid technologies, including design ideas.
31) IPC-2546
The combined needs of key points in a printed circuit board assembly. Material motion systems such as actuators and bumpers, manual placement, automatic screen printing, automatic adhesive dispensing, automatic surface mount placement, automatic plated through-hole placement, forced convection, infrared reflow ovens, and wave soldering are described.
32) IPC-PE-740A
Troubleshooting printed circuit board manufacturing and assembly. Includes case records and corrective actions for problems with printed circuit products during design, manufacturing, assembly, and testing.
33) IPC-6010
A series of printed circuit board quality standards and performance specifications. Includes quality and performance specifications developed by the American Printed Circuit Board Association for all printed circuit boards.
34) IPC-6018A
Inspection and testing of microwave finished printed circuit boards. Includes performance and qualification requirements for high frequency (microwave) printed circuit boards.
35) IPC-D-317A
Design guidelines for electronic packaging using high-speed technology. Provides guidance for the design of high-speed circuits, including mechanical and electrical considerations and performance testing.
