S1000-2 Shengyi Lead Free Compatible FR-4.0, FR-15.0 Rigid PCB Materials

S1000-2Characteristic● Lead-free compatible FR-4.0 laminate●Tg 170℃(DSC),UV Blocking/AOI compatible● High heat resistance● Low Z-axis CTE● Excellent through-holereliability●Excellent Anti-CAF performa...

S1000-2 PCB Base materials Rigid material base materials Shengyi Internationally known

S1000H Shengyi Lead Free Compatible FR-4.0, FR-15.0 Rigid PCB Materials

S1000HCharacteristic● Lead-free compatible FR-4.0● Excellent thermalreliability● LowZ-axis CTE● Good Anti-CAF performance and IST● Low water absorptionApplication Area● Computer and NB● Instruments● C...

S1000H PCB Materials PCB Base materials Rigid material base materials Shengyi Tg150

S1141 Shengyi Conventional FR-4 Rigid PCB Materials

Characteristic Tg140℃(DSC)●UV Blocking/AOI compatible● Excellent mechanical processabilityApplication Area● Computer,instrumentation,  VCR, communication equipment, electronic game...

S1141 PCB Materials PCB Base materials Rigid material base materials Shengyi Internationally known

Advanced PCBs common laminated structure design template

1. PCB stack method is recommended as Foil superposition method2. Minimize the use of PP and CORE models and types in the same stack (no more than 3 PP layers per layer).3. The thickness of PP medium ...

Advanced PCBs laminated structure PCB design template

Determining SMT Process and Its Packaging

Abstract:Standardized design is good for the accomplishment of electric with SMT and the improvement of production efficiency. Introduce the standardized design of process flow, the choice of componen...

High Frequency PCB Layout Techniques

Introduction:The components are developing towards high speed, low consumption, small volume and high anti-interference. PCB design is an important stage of electronic product design. It can realize t...

Signal Integrity Analysis for High-speed PCB

Signal Integrity Analysis for High-speed PCBIntroduction:As large-scale and ultra-large-scale integrated circuits are more and more applied to power circuit systems, the requirements of users are high...

Influence of PCB Quality Problem on Wave Soldering and Reflow Soldering

Background:After the production of PCB, the original components need to be assembled to be used further. At present, the most common assembly methods are wave soldering, reflow soldering and the combi...

Wave Soldering, Reflow Soldering

How to Design a PCB Panel for Less Money?

Introduction:PCB panel is a combination of several PCB unit boards with various possible connection modes, as shown in the figures below.Typical, when a hardware designer a PCB, he considers the elect...

panel

Defects Contrast between Wave Soldering and Reflow Soldering

Introduction:As a kind of traditional welding technology, wave soldering and reflow soldering play an active role in the field of electronic manufacturing in the assembling process of electronic produ...

Wave Soldering, Reflow Soldering

Notes for Gerber files Generated from Eagle 9.20

Note: For eagle the latest version 9.6.2, please click How to Generate Gerber and Drill Files From Eagle 9.6.2Several days ago, Eagle released the lastest version 9.20, which still provide the co...

Eagle; Gerber; PCB design

The Main Factors Affect the Quality of SMT Soldering and Its Solutions

Abstract: SMT process as the core of the electronic assembly process, the welding quality affects the overall quality of the products. For SMT industry, high quality welding quality is the basis of pr...

SMT Solder paste Stencil 3. Scraper Reflow Welding

Ball Grid Array (BGA)

Background:In the information age, the update speed of electronic products is accelerated. In one hand, the popularity of computers, mobile devices, portable devices and other products has made people...

Ball Grid Array (BGA)

The Application of AOI System in PCB

—created by PCBWayIntroduction: With the rapid development of IC industry and the improvement of special components as well as multifunction of electronic components, the number of pins...

PCB AOI

Organic Solderability Preservative (OSP)

—A Method of Surface Finish TechnologiesBackground:In recent years, electronic products are developing towards light, thin, short, miniaturized and multi-functional. At the same time, PCB is also deve...

Organic Solderability Preservative (OSP) SMT

Problems Encountered in PCB Design and Their Solutions

Brief Introduction:The improvement of hardware of electronic products often takes a long time, and the major problem is often the focus of solution. But it's the small, trivial issues that ul...

PCB Design rectifier diode 1. Voltage - resistant protection electromagnetic interference pads

Copper Clad Laminate

Introduction:The substrates used in PCB are mainly divided into two categories: organic substrates and inorganic substrates. Among them, the organic substrates are made of several types of materials w...

Copper Clad Laminate CCL FR-4 FR-5 CEM-1 CEM-3 FR-1 FR-2 1) Rigid CCL 2) Flexible CCL Copp

Surface Finish Technology

Background:At present, the environmental problems involved in PCB production are particularly prominent. Lead and bromine are the hottest topics at the moment; Lead-free and halogen-free will affect t...

Surface Finish Technology

Something You Must Know about Surface Mount Technology (SMT)

Introduction:Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). ...

PCB PCB Assembly SMT Surface-mount technology

What Do You Know About HDI

What Do You Know About HDI—by PCBWayBasic Information:HDI board refers to High Density Interconnect, namely High Density Interconnect board. It is a relatively new technology developed by PCB industry...

HDI

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