Initiating

see "activating".

Initiating

INDEX EDGE

INDEX EDGE MARKER, INDEXING HOLE, INDEXING NOTCH, INDEXING SLOT: See Locating Edge, Location Edge Marker,etc.

INDEX EDGE

Inclusion

A foreign particle in the conductive layer, plating, or base material.

Inclusion

In-circuit Test

A check of specific components(s) or cuicuits(s) within an assembly without their de-coupling from the primary circuit.

In-circuit Test

Impedance, Characteristic

The resistance of a parallel conductor structure to the flow of alternating current (ac), usually applied to high-speed circuits and normally consisting of a constant value over a wide range of freque...

Impedance Characteristic

Immersion Plating

The chemical deposition of a thin metallic coating over certain basis metals that is achieved by a partial displacement of the basis metal.     

Immersion Plating

Indentation

See “Pit”

Indentation

IC

Integrated Circuit.

IC

Hygroscopic

The ability of a material to absorb and retain moisture from the air.

Hygroscopic

Hot Zone

The section of a re-flow oven held at maximum temperature. Other zones include per-heat and cooling.

Hot Zone

Hole Void

A void in the metallic deposit of a plated through-hole exposing the base material.

Hole Void

Hole Pull Strength

The force necessary to rupture a plated through-hole when loaded or pulled in the direction of the axis of the hole.

Hole Pull Strength

Hole Pattern

The arrangement of all holes in a printed board.

Hole Pattern

Hole Location

The dimensional location of the centre of a hole.

Hole Location

Hole Density

The quantity of holes in a printed circuit board per unit area.

Hole Density

Hole Breakout

A condition in which a hole is not completely surrounded by the land.

Hole Breakout

Hipot Test

Wherein the assembly or component undergoes a high potential (ac) current.

Hipot Test

Heel,Bonding

The part of a lead adjacent to a termination that has been deformed by the edge of the bonding tool.

Heel,Bonding

Heat Sink

Any device that absorbs and draws off heat from a hot object, radiating it into the surrounding atmosphere.

Heat Sink

Heat and Pull

A de-soldering method using a device that grasps, heats and pulls the leads to be removed.

Heat and Pull

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Ranking Name Answers
1 _ Floppy Lab 4
2 PCBWay Team 3
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