A mass re-flow soldering system test for the capacity repeatedly to process boards regardless of their volume though the oven.
If a solder alloy with a long melting range is heated too slowly. the phase with the lowest melting point begins to flow first. The material left behind has a changed composition and a higher melting ...
A land that has fully or partially separated (lifted)from the base material, whether or not any resin is lifted with land.
A format of lettering or symbols on the printed board, e.g. Part number, component locations, and patterns.
The distance that a component lead protrudes through the side of a board that is opposite from the one upon which the component is mounted.
One in a series of levels in a board on which tracks are arranged to connect components. Vias connect tracks and zones between layers.
The thickness of dielectric material between adjacent layers of conductive circuitry in a multi-layer printed circuit board.
A combination of lands that is used to mount, interconnect and test a particular component.
The process of manufacturing a laminate; also the process used for application of a dry film photo-resist.
Multi-layer equipment that applies both pressure and heat to laminate and prepreg to make multi-layer boards.
Ranking | Name | Answers |
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1 | PCBWay Team | 6 |
2 | Engineer | 1 |
3 | Stephen Newport | 1 |