Load Test

A mass re-flow soldering system test for the capacity repeatedly to process boards regardless of their volume though the oven.

Load Test

Liquids

The lowest temperature at which filler metal (solder) is completely liquid.

Liquids

Liquation

If a solder alloy with a long melting range is heated too slowly. the phase with the lowest melting point begins to flow first. The material left behind has a changed composition and a higher melting ...

Liquation

Line

See Conductor.

Line

Lifted Land

A land that has fully or partially separated (lifted)from the base material, whether or not any resin is lifted with land.

Lifted Land

Legend

A format of lettering or symbols on the printed board, e.g. Part number, component locations, and patterns.

Legend

Lead Projection

The distance that a component lead protrudes through the side of a board that is opposite from the one upon which the component is mounted.

Lead Projection

Lead Mounting Hole

See Component Hole.

Lead Mounting Hole

Lead

(Pronounced “Leed”)-A terminal on a component.

Lead

LCCC

Leadless ceramic chip carrier.

LCCC

Layer

One in a series of levels in a board on which tracks are arranged to connect components. Vias connect tracks and zones between layers.

Layer

Layer-to-Layer Spacing

 The thickness of dielectric material between adjacent layers of conductive circuitry in a multi-layer printed circuit board.

Layer-to-Layer Spacing

Laser

Light Amplified by Stimulated Emission of Radiation.

Laser

Landless Hole

A plated through-hole without a land(s).

Landless Hole

Land

On a PCB, the conductive area(s) to which components are attached. Also called pad.

Land

Land Pattern

A combination of lands that is used to mount, interconnect and test a particular component.

Land Pattern

Lamination

The process of manufacturing a laminate; also the process used for application of a dry film photo-resist.

Lamination

Laminate Presses

Multi-layer equipment that applies both pressure and heat to laminate and prepreg to make multi-layer boards.

Laminate Presses

Laminate Void

Absence of laminate material in an area which normally contains laminate material.

Laminate Void

Laminate Thickness

Thickness of the metal clad base material, single- or double-sided, prior to any subsequent processing.

Laminate Thickness

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