Sheet material consisting of the base material impregnated with a synthetic resin, such as epoxy or polymide, ...
The process portion of the re-flow heat curve in which the PCB is heated from ambient at a pre-set ...
A resist which is decomposed (softened) by light and which, after exposure and development, is removed from those&n...
An artwork, artwork master, or production master in which the intended conductive pattern is opaque to light, and&n...
A printed board on to which all passive and active components have been assembled. Synonyms: printed board assembly...
(kapton) Higher melting point plastic film used as base for flexible portions of flexi-rigid boards as well as ...
High temperature thermoplastics used with glass to produce printed circuit laminates from multi-layer and other circuit ...
A technique of eliminating symmetry within a plane so that parts can be engaged in only one way in ...
A centimeter-gram-second unit of viscosity equal to that of a fluid requiring a shearing force of one dyne to&...
The practice of mechanically converting X - Y position information into a visual pattern, such as artwork.
The process consisting of the electrochemical deposition of a conductive material on the base material (surface holes, etc.) after the base material has been made conductive.
Materials which, when deposited on conductive areas, prevent the plating of the covered areas. Resists are available both as screened-on materials and as dry-film photopolymer resists.
The temporary conductive path interconnecting areas of a printed board to be electroplated, usually located on the panel outside the borders of such a board.
A hole with the deposition of metal (usually copper) on its sides to provide electrical connections between internal or external conductive patterns.
Pertaining to Laminating. The finish present on the metallic surface of metal clad base material resulting from direct contact with the laminating press plates without modification by any subsequent f...
Small holes or sharp edges on the surface of a solder joint generally caused by flux entrapment, oxidation or over-heating.
Ranking | Name | Answers |
---|---|---|
1 | PCBWay Team | 6 |
2 | Engineer | 1 |
3 | Stephen Newport | 1 |