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Modifying a Hotplate to a Reflow Solder Station
This is a project to modify a UYUE 946C model hotplate and convert it to a reflow soldering station.
The UYUE 946C hotplate is modified by replacing the original controller and by adding an additional heating element. The new controller is ESP32-based and has a TFT color display. The selection of an ESP32 is because it will allow a much more responsive display than an Arduino can accomplish. Hardware SPI is used to communicate with the TFT display and the K-Type temperature sensor.
The software allows you to select different solder pastes, and it will set the reflow profile dynamically. The main modes for the controller are: Reflow, Heat, Cooling and Warm-up. The parameters for these modes can be set by using a rotary encoder. The best results will be with lower temperature solder paste (138 degrees). Higher temperatures will work, the hotplate will reach 250 degrees, but the ramp-up is a bit slower that the profile asks for.
The heating elements are controlled by an SSR, and there is a 12V DC output to connect one of more 12V fans to aid in the cooling phase.
The complete description of the project is on my Blog that can be found here: https://www.paulvdiyblogs.net/2025/02/creating-hotplate-reflow-station.html There is also a Github project with all the required files and can be found here: https://github.com/paulvee/Hotplate-Controller
WARNING:
You will be dealing with live mains voltages, high currents and high temperatures.
Be extra careful, and if you are not qualified, ask somebody that is qualified to help you.
Modifying a Hotplate to a Reflow Solder Station
*PCBWay community is a sharing platform. We are not responsible for any design issues and parameter issues (board thickness, surface finish, etc.) you choose.

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Raspberry Pi 5 7 Inch Touch Screen IPS 1024x600 HD LCD HDMI-compatible Display for RPI 4B 3B+ OPI 5 AIDA64 PC Secondary Screen(Without Speaker)
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