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The holes design standard

Reason of failed review:

The holes will cut out the copper layer of vias, we couldn’t confirm if it is ok for you?

Suggestion:

1. If you don’t need to do the vias, pls delete it directly when you design

If you need to do the vias, pls keep a spacing between holes, the hole spacing usually is 0.2mm

Last updated on 12/03/2024

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Spacing between silkscreen and openings
Silkscreen standard size
do not design texts on the copper layer
notes in the order are different from the designs in the files
the bottom silkscreen is mirrored
limited holes spacing
silkscreen over pads
the spacing from hole to trace
The requirement of beveling on gold finger area
The spacing from one hole to another is too narrow
the spacing requirement from hole to the edge of board
Edge plating
the spacing requirement from slot to copper trace
Spiral coil board
BGA pad opening
No Gold fingers design in file
UL Marking
The are some pads out of the board outline
Design has no silkscreen layer but online is yes with silkscreen
Some Issues concerning BGA(Ball Grid Array)

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The holes design standard

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