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Stackup for 4, 6, 8,..., 18 layers Multi-layer laminated structure

Instant Quote & Order Online

4+6+4 HDI stackup Layer buildup/stackup reference

4+6+4 HDI PCB stackup

In the layer structure of a PCB board, there are several important concepts.
PP (Prepreg): Prepreg is a semi-cured sheet, also known as prepreg material, a thin sheet material that impregnated with resin and cured to an intermediate degree. It is mainly used as the bonding material and insulation material for inner conductive patterns of multilayer printed circuit boards. After being laminated with Prepreg, the semi-cured epoxy resin is squeezed out, begins to flow, and solidifies, bonding the multilayer circuit boards together and forming a reliable insulating layer. In the PCB industry, Prepreg can be likened to glue, used to bond several cores together using the lamination method to create multilayer boards.
PP Type:1080(3.1mil), 3313(4.2mil), 2116(5.4mil), 7628(7.7mil).

Core: Core is a rigid material with specific thickness and copper on both sides.
The pressing materials for multilayer boards mainly consist of Prepreg and Core.

The differences between the two are:
- Prepreg is a material used in PCBs, with a semi-solid texture similar to cardboard, while core is a rigid material similar to copper.
- Prepreg functions as both an adhesive and insulator, whereas core serves as the foundational material for PCBs, with entirely different functional roles.
- Prepreg can be flexible, while core cannot be bent.
- Prepreg is non-conductive, whereas core has copper layers on both sides, serving as the conductive medium for the printed circuit board.

In other special cases or Advanced PCBs (you need to choose "Customized Services and Advanced Options" and Custom stackup or Impedance control):
1. If you need custom stackup or control impedance, we will manufacture according to your requirement.
2. After place order,we will calculate whether it meets the requirements based on the stackup , material and impedance information.Also we will confirm with you.

For flexible PCB stackup, please check "Stack-up for FPC".

For rigid PCB, in response to customer demand, PCBWay has added a variety of laminate structures to our products (currently, we have added 298 and will continue to update them), which can greatly satisfy product structural design and impedance requirements.

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+86-571-85317532
GaggiMate Controller

I ordered the PCB just last week, and it arrived in only six days—much faster than I expected. The production process was without any problems, and there were absolutely no issues during manufacturing or delivery. The quality of the board looks excellent, and it matches my design perfectly. This PCB will be invaluable for confirming all the details before committing to the full production run. I'm genuinely impressed with the speed and reliability of the service, and I’m excited to start working with it to validate my project. This quick turnaround has saved me a lot of time and effort in my development process.

Ullrich

Fragaria27 keyboard

Perfect work as always, thanks for bringing the project to life.

Gzowski

PCB standard stackup Total: 298
Layers
  • Please Select
  • 4 Layers
  • 6 Layers
  • 8 Layers
  • 10 Layers
  • 12 Layers
  • 14 Layers
  • 16 Layers
  • 18 Layers
Thickness (MM)
  • Please Select
  • 0.4MM
  • 0.6MM
  • 0.8MM
  • 1.0MM
  • 1.2MM
  • 1.6MM
  • 2.0MM
  • 2.4MM
Inner Copper (OZ)
  • Please Select
  • 0.5OZ
  • 1OZ
  • 1.5OZ
  • 2OZ
  • 3OZ
  • 4OZ
  • 5OZ
Outer Copper (OZ)
  • Please Select
  • 1OZ
  • 2OZ
  • 3OZ
  • 4OZ
  • 5OZ
Inner layer Residual copper ratio (%)
  • Please Select
  • 90%
  • 70%
  • 50%
  • 30%
Search
Reset
Friendly Reminder: This is a through-hole board stack-up, not applicable for blind and buried vias. PCBWay supports customers to customize structures, and will continue to increase the structure diagrams.
4 Layers Total: 112
View all
1 4-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L2-CU Inner Copper 1OZ 0.0350 1.1
(Core with Cu)
CORE Core
DK:4.6 		1.0300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L4-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.51mm, tolerance: ±10%

Finished PCB Thickness: 1.61mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 4-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L2-CU Inner Copper 1OZ 0.0350 1.1
(Core with Cu)
CORE Core
DK:4.6 		1.0300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L4-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 4-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1715
L2-CU Inner Copper 1OZ 0.0350 1.1
(Core with Cu)
CORE Core
DK:4.6 		1.0300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1715
L4-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 4-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L2-CU Inner Copper 1OZ 0.0350 1.0
(Core with Cu)
CORE Core
DK:4.6 		0.9300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L4-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 4-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L2-CU Inner Copper 1OZ 0.0350 1.0
(Core with Cu)
CORE Core
DK:4.6 		0.9300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L4-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.46mm, tolerance: ±10%

Finished PCB Thickness: 1.56mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 4-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1715
L2-CU Inner Copper 1OZ 0.0350 1.0
(Core with Cu)
CORE Core
DK:4.6 		0.9300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1715
L4-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.45mm, tolerance: ±10%

Finished PCB Thickness: 1.55mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

SHOW MORE
6 Layers Total: 74
View all
1 6-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1750
L4-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L6-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.45mm, tolerance: ±10%

Finished PCB Thickness: 1.55mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 6-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L2-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L4-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L6-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 6-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L6-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.45mm, tolerance: ±10%

Finished PCB Thickness: 1.55mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

4 6-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.2250
PP 2116 RC58%
DK:4.45 		0.1300
L4-CU Inner Copper 1OZ 0.0350 0.5
(Core with Cu)
CORE Core
DK:4.6 		0.4300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L6-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.56mm, tolerance: ±10%

Finished PCB Thickness: 1.66mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

5 6-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L2-CU Inner Copper 1OZ 0.0350 1.0
(Core with Cu)
CORE Core
DK:4.6 		0.9300
L3-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L4-CU Inner Copper 1OZ 0.0350 1.0
(Core with Cu)
CORE Core
DK:4.6 		0.9300
L5-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L6-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

6 6-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L2-CU Inner Copper 1OZ 0.0350 0.9
(Core with Cu)
CORE Core
DK:4.6 		0.8300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L4-CU Inner Copper 1OZ 0.0350 0.9
(Core with Cu)
CORE Core
DK:4.6 		0.8300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L6-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.35mm, tolerance: ±10%

Finished PCB Thickness: 2.45mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

SHOW MORE
8 Layers Total: 49
View all
1 8-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1750
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1750
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L8-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.52mm, tolerance: ±10%

Finished PCB Thickness: 1.62mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 8-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L8-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 8-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L8-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.46mm, tolerance: ±10%

Finished PCB Thickness: 1.56mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

4 8-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 2OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L8-CU Outer Base Copper 1.5OZ 0.0525 0.0525
(Plating to 2OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

5 8-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.6
(Core with Cu)
CORE Core
DK:4.6 		0.5300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.6
(Core with Cu)
CORE Core
DK:4.6 		0.5300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.6
(Core with Cu)
CORE Core
DK:4.6 		0.5300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L8-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

6 8-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.6
(Core with Cu)
CORE Core
DK:4.6 		0.5300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.6
(Core with Cu)
CORE Core
DK:4.6 		0.5300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.6
(Core with Cu)
CORE Core
DK:4.6 		0.5300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L8-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.25mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

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10 Layers Total: 33
View all
1 10-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1750
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1750
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1750
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L10-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 10-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0855
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1610
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0855
L10-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 10-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L10-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.49mm, tolerance: ±10%

Finished PCB Thickness: 1.59mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 10-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L2-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L9-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L10-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 10-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L2-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L8-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L9-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L10-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.28mm, tolerance: ±10%

Finished PCB Thickness: 2.38mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 10-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L2-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L4-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L6-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L7-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L8-CU Inner Copper 1OZ 0.0350 0.4
(Core with Cu)
CORE Core
DK:4.6 		0.3300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L10-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.29mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

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12 Layers Total: 12
View all
1 12-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L12-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.55mm, tolerance: ±10%

Finished PCB Thickness: 1.65mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 12-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0855
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0680
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0680
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0680
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0680
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0855
L12-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.48mm, tolerance: ±10%

Finished PCB Thickness: 1.58mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 12-layers PCB
Thickness: 1.6MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0785
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0785
L12-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.52mm, tolerance: ±10%

Finished PCB Thickness: 1.62mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 12-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L10-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L11-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1855
L12-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.34mm, tolerance: ±10%

Finished PCB Thickness: 2.44mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 12-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L8-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L10-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L11-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1785
L12-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.27mm, tolerance: ±10%

Finished PCB Thickness: 2.37mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 12-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L2-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L3-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L4-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L5-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L6-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L7-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L8-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L9-CU Inner Copper 1OZ 0.0350
PP 7628 RC46%
DK:4.74 		0.1960 0.1470
L10-CU Inner Copper 1OZ 0.0350 0.3
(Core with Cu)
CORE Core
DK:4.6 		0.2300
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L12-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

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14 Layers Total: 6
View all
1 14-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L10-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L12-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L14-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.26mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 14-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 1080 RC68%
DK:4.21 		0.0810 0.1935
PP 2116 RC58%
DK:4.45 		0.1300
L2-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L8-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L10-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L12-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1935
PP 1080 RC68%
DK:4.21 		0.0810
L14-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.34mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 14-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.2085
PP 2116 RC58%
DK:4.45 		0.1300
L2-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L4-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L6-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L8-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L10-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L12-CU Inner Copper 1OZ 0.0350 0.24
(Core with Cu)
CORE Core
DK:4.6 		0.1700
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.2085
PP 3313 RC58%
DK:4.45 		0.1030
L14-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.39mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 14-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L12-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L13-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L14-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.97mm, tolerance: ±10%

Finished PCB Thickness: 2.07mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 14-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L12-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L14-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 14-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L12-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L14-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.85mm, tolerance: ±10%

Finished PCB Thickness: 1.95mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

16 Layers Total: 6
View all
1 16-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L12-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L14-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L16-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.33mm, tolerance: ±10%

Finished PCB Thickness: 2.43mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 16-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1760
PP 1080 RC68%
DK:4.21 		0.0810
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1760
PP 2116 RC58%
DK:4.45 		0.1300
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L12-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L14-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L16-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.39mm, tolerance: ±10%

Finished PCB Thickness: 2.49mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 16-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L2-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L3-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L4-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L5-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L6-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L7-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L8-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L9-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L10-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L11-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L12-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L13-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L14-CU Inner Copper 1OZ 0.0350 0.2
(Core with Cu)
CORE Core
DK:4.6 		0.1300
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L16-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.32mm, tolerance: ±10%

Finished PCB Thickness: 2.42mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 16-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L10-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L12-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L14-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L16-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 16-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L2-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1760
PP 1080 RC68%
DK:4.21 		0.0810
L8-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L9-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1760
PP 2116 RC58%
DK:4.45 		0.1300
L10-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L12-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L14-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L16-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.94mm, tolerance: ±10%

Finished PCB Thickness: 2.04mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 16-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 1080 RC68%
DK:4.21 		0.0810 0.1375
PP 1080 RC68%
DK:4.21 		0.0810
L2-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L3-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L4-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L5-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L6-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L7-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L8-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L9-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L10-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L11-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L12-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L13-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L14-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L15-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1375
PP 1080 RC68%
DK:4.21 		0.0810
L16-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.93mm, tolerance: ±10%

Finished PCB Thickness: 2.03mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

18 Layers Total: 6
View all
1 18-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L2-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L4-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L6-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L8-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L10-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L12-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L14-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1090
L16-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L17-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1195
L18-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.25mm, tolerance: ±10%

Finished PCB Thickness: 2.35mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

2 18-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 1080 RC68%
DK:4.21 		0.0810 0.1935
PP 2116 RC58%
DK:4.45 		0.1300
L2-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L4-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L6-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L8-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L10-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L12-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L14-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0950
L16-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L17-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1935
PP 1080 RC68%
DK:4.21 		0.0810
L18-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.3mm, tolerance: ±10%

Finished PCB Thickness: 2.40mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

3 18-layers PCB
Thickness: 2.4MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 1080 RC68%
DK:4.21 		0.0810 0.1375
PP 1080 RC68%
DK:4.21 		0.0810
L2-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L3-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L4-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L5-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L6-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L7-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L8-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L9-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L10-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L11-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L12-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L13-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L14-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L15-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1130
PP 1080 RC68%
DK:4.21 		0.0810
L16-CU Inner Copper 1OZ 0.0350 0.151
(Core with Cu)
CORE Core
DK:4.6 		0.0810
L17-CU Inner Copper 1OZ 0.0350
PP 1080 RC68%
DK:4.21 		0.0810 0.1375
PP 1080 RC68%
DK:4.21 		0.0810
L18-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 2.31mm, tolerance: ±10%

Finished PCB Thickness: 2.41mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

4 18-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 70%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L2-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L3-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L4-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L5-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L6-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L7-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L8-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L9-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L10-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L11-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L12-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L13-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L14-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L15-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0820
L16-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L17-CU Inner Copper 1OZ 0.0350
PP 3313 RC58%
DK:4.45 		0.1030 0.0925
L18-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

Inner layer Residual copper ratio > 60%, it is suitable to choose a lamination structure with 70% inner layer Residual copper ratio.

5 18-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 0.5OZ
Inner layer Residual copper ratio: 50%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1213
L2-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L3-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L4-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L5-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L6-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L7-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L8-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L9-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L10-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L11-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L12-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L13-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L14-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L15-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1125
L16-CU Inner Copper 0.5OZ 0.0175 0.1
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L17-CU Inner Copper 0.5OZ 0.0175
PP 2116 RC58%
DK:4.45 		0.1300 0.1213
L18-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.87mm, tolerance: ±10%

Finished PCB Thickness: 1.97mm, tolerance: ±10%

40% < Inner layer Residual copper ratio ≤ 60%, it is suitable to choose a lamination structure with 50% inner layer Residual copper ratio.

6 18-layers PCB
Thickness: 2.0MM
Finished Outer Copper: 1OZ
Inner Copper: 1OZ
Inner layer Residual copper ratio: 30%
Layer Material Thickness
(mm) 		Thickness after lamination(mm)
L1-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L2-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L3-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L4-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L5-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L6-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L7-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L8-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L9-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L10-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L11-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L12-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L13-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L14-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L15-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.0810
L16-CU Inner Copper 1OZ 0.0350 0.135
(Core with Cu)
CORE Core
DK:4.6 		0.0650
L17-CU Inner Copper 1OZ 0.0350
PP 2116 RC58%
DK:4.45 		0.1300 0.1055
L18-CU Outer Base Copper 0.5OZ 0.0175 0.0175
(Plating to 1OZ)

Thickness after lamination: 1.89mm, tolerance: ±10%

Finished PCB Thickness: 1.99mm, tolerance: ±10%

Inner layer Residual copper ratio ≤ 40%, it is suitable to choose a lamination structure with 30% inner layer Residual copper ratio.

  • 4 Layers
  • 6 Layers
  • 8 Layers
  • 10 Layers
  • 12 Layers
  • 14 Layers
  • 16 Layers
  • 18 Layers
Front-end data preparation

01.PPE - Pre Production Engineering

Customer supplied data (gerber) is used to produce the manufacturing data for the specific PCB (artworks for imaging processes and drill data for drilling programs). Engineers compare demands/specifications against capabilities to ensure compliance and also determine the process steps and associated checks. No changes are allowed without PCBWay Group permission.

Preparing

02.Board Cutting (Copper Clad Laminate Cutting)

PCB production starts with a large piece of sheet material. Due to the limitations of PCB production equipment and manufacture capabilities, the factory has requirements for its minimum and maximum processing size. Therefore, under the guidance of manufacture instruction (MI), the raw material of PCB (Copper Clad Laminate ) needs to be cut into the processing size by automatic cutting machine before production.

print icon

03.Print inner layers

Stage 1 is to transfer the image using an artwork film to the board surface, using photosensitive dry-film and UV light, which will polymerise the dry film exposed by the artwork. This step of the process is performed in a clean room.<br> Imaging – The process of transferring electronic data to the photo-plotter, which in turn uses light to transfer a negative image circuitry pattern onto the panel or film.

etch icon

04.Etch inner layers

Stage 2 is to remove the unwanted copper from the panel using etching. Once this copper has been removed, the remaining dry film is then removed leaving behind the copper circuitry that matches the design.<br> Etching – The chemical, or chemical and electrolytic, removal of unwanted portions of conductive or resistive material.

aoi icon

05.Inner layer Automatic Optical Inspection(AOI)

Inspection of the circuitry against digital “images” to verify that the circuitry matches the design and that it is free from defects. Achieved through scanning of the board and then trained inspectors will verify any anomalies that the scanning process has highlighted. PCBWay Group allows no repair of open circuits.

Lamination icon

06.Lay-up and bond (Lamination)

The inner layers have an oxide layer applied and then “stacked” together with pre-preg providing insulation between layers and copper foil is added to the top and bottom of the stack. The lamination process consists of placing the internal layers under extreme temperature (375 degrees Fahrenheit) and pressure (275 to 400 psi) while laminating with a photosensitive dry resist. The PCB is allowed to cure at a high temperature, the pressure is slowly released and then the material is slowly cooled.

drilling icon

07.Drilling the PCB

We now have to drill the holes that will subsequently create electrical connections within the multilayer PCB. This is a mechanical drilling process that must be optimised so that we can achieve registration to all of the the inner layer connections. The panels can be stacked at this process. The drilling can also be done by a laser drill

copper icon

08.Electroless copper deposition

The first step in the plating process is the chemical deposition of a very thin layer of copper on the hole walls.
PTH provides a very thin deposit of copper that covers the hole wall and the complete panel. A complex chemical process that must be strictly controlled to allow a reliable deposit of copper to be plated even onto the non-metallic hole wall. Whilst not a sufficient amount of copper on its own, we now have electrical continuity between layers and through the holes.Panel plating follows on from PTH to provide a thicker deposit of copper on top of the PTH deposit – typically 5 to 8 um. The combination is used to optimise the amount of copper that is to be plated and etched in order to achieve the track and gap demands.

image icon

09.Image the outer layers

Similar to the inner layer process (image transfer using photosensitive dry film, exposure to UV light and etching), but with one main difference – we will remove the dry film where we want to keep the copper/define circuitry – so we can plate additional copper later in the process.
This step of the process is performed in a clean room.

Plating icon

10.Plating

Second electrolytic plating stage, where the additional plating is deposited in areas without dry film (circuitry). Once the copper has been plated, tin is applied to protect the plated copper.

etch icon

11.Etch outer layer

This is normally a three step process. The first step is to remove the blue dry film. The second step is to etch away the exposed/unwanted copper whilst the tin deposit acts an etch resist protecting the copper we need. The third and final step is to chemically remove the tin deposit leaving the circuitry.

AOI

12.Outer layer AOI

Just like with inner layer AOI the imaged and etched panel is scanned to make sure that the circuitry meets design and that it is free from defects. Again no repair of open circuits are allowed under PCBWay demands.

Soldermask

13.Soldermask

Soldermask ink is applied over the whole PCB surface. Using artworks and UV light we expose certain areas to the UV and those areas not exposed are removed during the chemical development process – typically the areas which are to be used as solderable surfaces. The remaining soldermask is then fully cured making it a resilient finish.<br> This step of the process is performed in a clean room.

Surface finish

14.Surface finish

Various finishes are then applied to the exposed copper areas. This is to enable protection of the surface and good solderability. The various finishes can include Electroless Nickel Immersion Gold, HASL, Immersion Silver etc. Thicknesses and solderability tests are always carried out.

Profile

15.Profile

This is the process of cutting the manufac-turing panels into specific sizes and shapes based upon the customer design as defined within the gerber data. There are 3 main options available when providing the array or selling panel – scoring, routing or punching. All dimensions are measured against the customer supplied drawing to ensure the panel is dimensionally correct.

Electrical test

16.Electrical test

Used for checking the integrity of the tracks and the through hole interconnections – checking to ensure there are no open circuits or no short circuits on the finished board. There are three test methods, flying probe for smaller volumes,fixture based for volumes and 4-wire Kelvin testing (For PCBs use in automotive, or aerospace applications).We electrically test every PCB against the original board data. Using a flying probe tester we check each net to ensure that it is complete (no open circuits) and does not short to any other net.

inspection

17.Final inspection

In the last step of the process a team of sharp-eyed inspectors give each PCB a final careful check-over.Visual checking the PCB against acceptance criteria and using PCBWay “approved” inspectors. Using manual visual inspection and AVI – compares PCB to gerber and has a faster checking speed that human eyes, but still requires human verification. All orders are also subjected to a full inspection including dimensional, solderability, etc.

Packaging

18.Packaging

Boards are wrapped using materials that comply with the PCBWay Packaging demands (ESD etcetera) and then boxed prior to be being shipped using the requested mode of transport.

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