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HDI PCB Service

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What is HDI PCB?

HDI PCB stands for High-Density Interconnect board. According to IPC-2226, HDI is defined as a printed circuit board with a wiring density per unit area higher than that of traditional printed circuit boards (PCBs). It is manufactured using micro-blind-buried via technology, resulting in high circuit distribution density. Therefore, HDI circuit boards are also referred to as buried blind via boards or blind and buried via circuit boards.

HDI PCB

The Advantage of HDI PCB

Improved Reliability

Microvias, with their smaller aspect ratio, provide enhanced reliability compared to typical vias. They are more robust and utilize superior materials and components, resulting in excellent performance in HDI (High-Density Interconnect) technology.

Enhanced Signal Integrity

HDI technology employs via-in-pad, blind-via, and buried-via techniques, which bring components closer together, thereby reducing signal path lengths. By eliminating via stubs, HDI technology decreases signal reflection and improves signal quality, significantly enhancing overall signal integrity.

Cost-effectiveness

With proper planning, HDI technology can lower overall costs compared to standard PCBs. This is achieved through fewer layers, smaller dimensions, and a reduced number of required PCBs.

Compact Design

The use of blind and buried vias minimizes the space requirements of the circuit board.

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HDI PCB Manufacturing Capabilities
Feature Capability
Via Types Blind via, buried via, through-hole via
Number of layers Up to 60 layers (evaluation required above 30 layers)
HDI builds 1+N+1, 2+N+2 , ... , 6+N+6(≥6 orders require evaluation)
Copper weights( finished) 18um-70um
Min trace/spacing 0.065mm/0.065mm
PCB thickness 0.1-8.0mm (evaluation required for less than 0.2mm or greater than 6.5mm)
Max. PCB dimension(finished) 2-20 layers, 21*33 inches; length ≤ 1000mm; evaluate if short side > 21 inches
Feature Capability
Min. mechanical drilling 0.15mm
Min. laser drilling Standard 4 mil, 3 mil require evaluation (corresponding to single 106PP).
Max. laser drilling 8 mil (corresponding dielectric thickness cannot exceed 0.15mm)
Min. controlled depth drilling PTH: 0.15mm; NPTH: 0.25mm
Aspect ratio Max 14:1; evaluate if greater.
Min. solder mask bridge 4mil(green, ≤1OZ)
5mil(other colors, ≤1OZ)
Diameter range of resin-filled vias 0.254-6.5mm

Common HDI PCB Stack-ups

Stack-up structures

Stack-up structures

Understanding different HDI PCB stack-up structures provides designers with greater flexibility in layer allocation, component placement, and routing options, enabling efficient utilization of available space and optimization of the PCB layout. The common HDI PCB stack-up structures are as follows.

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Featured Product Solutions

After years of relentless R&D and technological advancement, PCBWay has become a benchmark in the rapid manufacturing of small to medium batch HDI PCBs. Evolving from the initial 1+N+1, 2+N+2 to 3+N+3, and now to 5+N+5/6+N+6/7+N+7, PCBWay has successfully transitioned from rapid prototyping to stable mass production, shaping a well-respected brand with a commitment to absolute quality assurance.

Manufacturing Production Capacity

Upgrading of copper deposition line
Upgrading of copper deposition line
Improve the process capability of PTH sunk copper (especially blind holes) to provide customers with high reliability products.
VCP copper plating line
VCP copper plating line
Enhance copper plating capacity, improve copper plating uniformity, and have HDI hole filling capability.
4-wire flying probe tester
4-wire flying probe tester
Better discriminate the product micro open circuit, micro short circuit, provide high precision resistance test requirements, make the product more reliable.
LDI laser direct imaging exposure machine
LDI laser direct imaging exposure machine
Achieves higher resolution while balancing the need for high alignment accuracy and high throughput.
Vacuum press
Vacuum press
Enhance the effect of laminating rigid-flex PCBs and multilayer PCBs.
Laser equipment
Laser equipment
Improve sample response speed as well as cover film,contour processing accuracy, with HDI laser drilling capability.
PCBWay's Advantages
PCBWay offers a wide range of PCB services, including flex, rigid-flex, and rigid PCB fabrication, ensuring that we can cater to diverse project requirements. We use top-grade materials and state-of-the-art equipment to guarantee optimal performance and reliability of their PCBs. PCBWay's commitment to quality, affordability, and customer satisfaction makes us a top choice for businesses and individuals seeking high-quality, customized, and reliable PCB fabrication services.
5+N
Factories
70+
Specialists
2800+
Passionate Employees
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Testing and Inspection Equipment
Salt spray tester
X-ray surface treatment thickness gauge
Metallographic section microscope
AOI inspection machine
Ion contamination tester
2D dimensional measuring instrument
Impedance tester
RoHS/HF tester

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FAQ's

Why switch to HDI PCB design?

In cases of higher circuit complexity, using structures with blind and buried vias often achieves better yield and lower costs, providing advantages over traditional through-hole designs.

What is aspect ratio?

The aspect ratio in a PCB refers to the ratio of the depth of a hole to its diameter. It is commonly used to assess the manufacturability and performance of the hole. A higher aspect ratio indicates that the depth of the hole is greater relative to its diameter, which can pose challenges in the drilling and filling processes.

What is the range of laser drilling?

PCBWay can perform laser drilling with a minimum of 4 mil and a maximum of 8 mil.

What is the minimum PP thickness for laser blind vias?

In standard prototyping, the minimum PP thickness for laser blind vias is 0.06mm.

What is the minimum core thickness for laser blind vias?

In standard prototyping, the minimum core thickness for laser blind vias is 0.1mm.

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