PCB Prototype the Easy Way

Full feature custom PCB prototype service.

Help Center
Sending a message
9:00 - 23:00, Mon.- Sun. (GMT+8)
Service hotlines
+86 571 8531 7532

9:00 - 18:00, Mon.- Fri. (GMT+8)

9:00 - 12:00, Sat. (GMT+8)

(Except Chinese public holidays)

Example printed circuit boards manufactured by us.

We have the PCB manufacturing capabilities to build simple to complex bare boards.
Please review the example printed circuits below and let us know if you have any
questions or would like a formal quote.

Focus on high-end PCB design, R&D, production, sales, provide customers with high-level, high-speed, high-frequency, high-end,
high-density, high-difficulty HDI PCB design and other types of PCB proofing, customization, board manufacturing and bulk online
order purchase service. The products have covered high-end HDI buried blind hole PCB, 5G communication PCB board, high frequency
and high speed PCB, optical module PCB, semiconductor test, aerospace PCB circuit board and many other fields.

原图
Mouse over to zoom in

5G Internet of Things PCB

Applications
5G Internet of Things
Features
/
Material
S1000-2M
Layers
8 Layers
Thickness
1.0±0.1mm
Min Hole Size
Laser hole 0.127mm; mechanical hole 0.20mm
Min Track/Spacingh
55/55um
Minimum board thickness and hole ratio
8:1
Surface Finish
Immersion gold(ENIG)+OSP 55/55um
Quote Now
Product Details

The 5G Internet of Things PCB board is produced by the process of Shengyi S1000-2M material mixing and surface immersion gold + OSP. The PCB board is widely used in the field of 5G Internet of Things.

5g-3-1.jpeg

Related Products View more >>
  • Communication 4-layer PCB

    4 layers, Thickness: 1.12mm, Surface Finish: HASL lead free

  • Double-sided communication high frequency PCB

    2 layers, Thickness: 1.2mm

  • Rogers PCB

    2 layers, Thickness: 1.6mm, Surface Finish: Immersion gold(ENIG)

  • HDMI circuit board

    6 layers, Thickness: 1.6mm, Surface Finish: Immersion gold(ENIG)

  • High frequency and high speed PCB

    6 layers, Thickness: 2.6mm, Size: 6*6cm

  • High-level impedance PCB

    10 layers, Material: FR4, Thickness: 1.6mm

  • Half-hole module PCB

    6 layers, Thickness: 1.0mm, Surface Finish: Immersion gold(ENIG) 3U"

  • 12-layer impedance PCB

    12 layers, Material: FR4, Thickness: 1.6mm

  • 5G module PCB

    4 layers, Thickness: 0.8mm, Surface Finish: Immersion gold(ENIG)

  • 5G Immersion Gold PCB

    6 layers, Thickness: 1.6mm, Surface Finish: Immersion gold(ENIG)

  • 5G signal test PCB

    4 layers, Material: RO4350B+TU768, Thickness: 1.6mm

  • 5G mobile phone PCB motherboard

    12 layers, Material: S1000-2M, Thickness: 1.2±0.1mm