6th-order arbitrary interconnection HDI buried/blind via circuit board

PCB Products / HDI PCB / 6th-order arbitrary interconnection HDI buried/blind via circuit board

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Applications

Digital products and automotive electronics

Features

Material

S1000-2M

Layers

14 Layers

Thickness

1.6±0.1mm

Min Hole Size

Laser hole 0.15mm; mechanical hole 0.20mm

Min Track/Spacingh

75/75um

Minimum board thickness and hole ratio

8:1

Surface Finish

Immersion gold(ENIG) 0.05um

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Product Details

6th-order arbitrary interconnection HDI buried blind via circuit board, the Min Track/Spacing can reach 75um, and the minimum aperture can reach 0.1mm. This type of buried blind via circuit board is widely used in digital cameras, notebooks, mobile phones and other electronic digital products and automotive electronics.

PCB Capabilities

Advanced PCB Capabilities

Multi-layer laminated structure

Quick turn PCB Fabrication

PCB Prototyping

Low-volume Production

Production Process

PCB Products

FAQ of PCB

PCBA Capabilities

PCB Assembly Capability

Special Reminders

File Requirements

PCB Assembly FAQ

Production Process

PCB Assembly Products

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