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The "7th generation HDI (High Density Interconnect) PCB circuit board with arbitrary interconnections" is one of the series of 7th generation HDI PCB circuit boards developed and manufactured by PCBWay. This particular 7th generation HDI circuit board is fabricated using Shengyi S1000-2M material and undergoes multiple processes such as laser drilling and lamination. The 7th generation HDI board finds extensive applications in high-end smartphones and other similar industries.
12 layers, Material: S1000-2M, Thickness: 1.2±0.1mm
14 layers, Thickness: 1.6±0.16, Surface Finish: OSP
12 layers, Material: S1000-2M, Thickness: 1.8±0.18mm
8 layers, Material: S1000-2M, Thickness: 4.4±0.4mm
8 layers, Material: S1000-2M, Thickness: 1.2±0.1mm
10 layers, Material: S1000-2M, Thickness: 1.3±0.13mm
14 layers, Material: S1000-2M, Thickness: 1.6±0.1mm
10 layers, Material: S1000-2M, Thickness: 2.2±0.2mm
8 layers, Material: A1000-2M, Thickness: 2.5±0.25mm
8 layers, Material: R5775G+IT180, Thickness: 2.0±0.2mm
8 layers, Material: S1000-2M, Thickness: 1.0±0.1mm
18 layers, Material: RO4350B+TU872SLK Rogers, Thickness: 3.2±0.32mm
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Our customer service+86-571-85317532
boards came very well packaged and built very well. i am pleased. you have definitely mastered the skills for pcb and it's a very fast and reliable project. this was my second pcb project and I am pleased with the results. it's also a very fast process to get pcb's built by you. I will order more pcb's from you.
Engineer
ESP32-S3 Development Kit, Program Test with Components: ADC, Power Supply 5 DCV, 3.3 DCV, I2C, LED's, RGB LED's, JTAG, Push Buttons, Boot and Reset Push Buttons, PWM, Relay, SPI, USB OTG, USB Prog., UART.-
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