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3rd-order 18-layer buried/blind via PCB, mainly used in the field of chip testing.
24 layers, Material: TU872SLK, Thickness: 3.2±0.32mm
24 layers, Material: TU872SLK, Thickness: 3.2±0.32mm
20 layers, Material: TU-872, Thickness: 5.0±0.5mm
16 layers, Material: S1000-2M, Thickness: 6.5mm±0.3mm
16 layers, Material: S1000-2M, Thickness: 2.5±0.25mm
14 layers, Material: S1000-2M, Thickness: 5.0mm±0.5mm
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Excelent!!
Engineer
product was built to specifications with care, has high quality legit source components used to manufactured this project.
Engineer