14-layer high-thickness-to-diameter ratio semiconductor test thick gold PCB

PCB Products / High-level PCB / 14-layer high-thickness-to-diameter ratio semiconductor test thick gold PCB

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Applications

Semiconductor test

Features

Material

S1000-2M

Layers

14 Layers

Thickness

5.0mm±0.5mm

Min Hole Size

Mechanical hole 0.35mm

Min Track/Spacingh

100/90um

Minimum board thickness and hole ratio

14:1

Surface Finish

Immersion gold(ENIG) 5u"

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Product Details

14-layer high-thickness-to-diameter ratio semiconductor test thick gold board, made of Shengyi S1000-2M material, thick gold plating on the surface and other production processes. The Min Track/Spacing can reach 100/90um, and the minimum mechanical hole can reach 0.35mm. Mainly used in the field of semiconductor testing, it is an ideal choice for the field of semiconductor testing.

PCB Capabilities

Advanced PCB Capabilities

Multi-layer laminated structure

Quick turn PCB Fabrication

PCB Prototyping

Low-volume Production

Production Process

PCB Products

FAQ of PCB

PCBA Capabilities

PCB Assembly Capability

Special Reminders

File Requirements

PCB Assembly FAQ

Production Process

PCB Assembly Products

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GaggiMate Controller

I ordered the PCB just last week, and it arrived in only six days—much faster than I expected. The production process was without any problems, and there were absolutely no issues during manufacturing or delivery. The quality of the board looks excellent, and it matches my design perfectly. This PCB will be invaluable for confirming all the details before committing to the full production run. I'm genuinely impressed with the speed and reliability of the service, and I’m excited to start working with it to validate my project. This quick turnaround has saved me a lot of time and effort in my development process.

Ullrich

Fragaria27 keyboard

Perfect work as always, thanks for bringing the project to life.

Gzowski

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